Backside power delivery reaches volume
2025-11Intel (18A)
Intel's 18A brought PowerVia backside power to a volume node — a structural change rivals are still adopting.
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Intel
Profile
IDM and emerging external foundry; brought backside power (PowerVia) to volume with 18A as its comeback bet.
Editorial profile — compiled by us from public sources.
- Founded
- 1968
- Headquarters
- Santa Clara, CA, US
Current standings
Standings and milestones are always verified by us against primary sources, regardless of who manages the profile.
Roadmap & milestones
18A-P enters risk production (eyeing Apple foundry)
~ 2026-06Intel (18A-P)
Intel began risk production of 18A-P (announced at the VLSI Symposium, 16 Jun 2026) — an enhanced 18A offering ~9% more performance or ~18% lower power, aimed at external foundry customers and widely seen as the node that could land an Apple SoC deal. Volume is targeted by end-2026, with Apple-made parts reported for 2027 — not yet confirmed.
Apple–Intel US chip partnership reported
~ 2026-06Intel / Apple
President Trump said (on Truth Social, 18 Jun 2026) that Apple has agreed to work with Intel on US chip design and manufacturing — sending Intel up ~9%. It follows a WSJ report of a preliminary deal after a year of talks, with Intel likely starting on simpler M-series parts before iPhone silicon, helping Apple diversify from TSMC. Neither company has confirmed scope, timing or structure — so this remains unconfirmed.
